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Products > Electroplating intermediate > Electroplating intermediate of Cu |
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Products |
CAS.No. |
Assay |
| N,N,N,’N’ -tetra(2-hydropropayl) ethylene diamine |
75%,95% |
SIL050E |
| Ethylene Diamine Tetraacetic Acid (EDTA) |
99% |
SIL051E |
| Bis-(sodium sulfopropyl)-disulfide |
85%,90%,95%,97%,98% |
SIL052E |
| 3-mercapto-1-propane sulfonic acid, sodium salt) |
98% |
SIL053E |
| N,N-Dimethyl-dithiocarbamyl propyl sulfonic acid, |
98% |
SIL054E |
| 3-S-Isothiuronium propyl sulfonate |
95% |
SIL055E |
| 3-(Benzothiazolyl-2-mercapto)-propyl-sulfonic aci |
90% |
SIL056E |
| 2-mercapto thiazoline |
99% |
SIL057E |
| 2-Mercapto benzanidazole |
99% |
SIL058E |
| Ethlenethiourea |
99% |
SIL059E |
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Total Products: 10
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Fluorochemical
Electroplating intermediate of Ni